Cabinet Approves MoC on Japan-India Semiconductor Supply Chain Partnership

  • Chaired by Prime Minister Shri Narendra Modi.
  • Signed in July 2023 between the Ministry of Electronics and Information Technology of the Republic of India and the Ministry of Economy, Trade and Industry of Japan
  • To strengthen cooperation between India and Japan towards enhancement of the semiconductor supply chain, recognizing the importance of semiconductors for the advancement of industries and digital technologies.
  • The Memorandum of Cooperation shall come into effect from the date of signature of the Parties and shall remain in force for five years.
  • Both G2G and B2B Bilateral Cooperation on opportunities to advance resilient semiconductor supply chain and leverage complementary strengths.

Background:

  • Programme for Development of Semiconductor and Display Manufacturing Ecosystem in India was introduced to ensure the development of a sustainable semiconductor and display ecosystem in India.
  • Aims to extend fiscal support for the establishment of Semiconductor Fabs, Display Fabs, Fabs for Compound, Semiconductors/Silicon Photonics/Sensors/Discrete Semiconductors and Semiconductor Assembly, Testing, Marking, and Packaging (ATMP)/Outsourced Semiconductor Assembly and Test (OSAT) facilities.
  • India Semiconductor Mission (ISM) was established under Digital India Corporation (DIC) to drive India’s strategies for the development of the semiconductor and display manufacturing ecosystem
  • “India-Japan Digital Partnership” (IJDP) was launched during the visit of PM Modi to Japan in October 2018.
Posted in Current Affairs.